D HBM-on-GPU design reaches record compute density for demanding AI workloadsPeak GPU temperatures exceeded 140°C without thermal mitigation strategiesHalving the GPU clock rate reduced temperatures ...
Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
TL;DR: Huawei is set to lead Apple by integrating high-performance HBM DRAM with 3D stacking technology in smartphones, boosting AI efficiency and bandwidth while reducing chip size. Apple plans to ...
Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron. According to reports from TheElec and ZDNet Korea, citing industry sources, ...
Turn photos into 3D with Meta's SAM 3D, using SAM 2 masks and Gaussian splatting, so you can build assets quickly for ...
Tech Soft 3D, a provider of engineering software development toolkits (SDKs) for engineering software, recently acquired Actify's core business, including CAD viewer and collaboration tool SpinFire.
Generative AI is transforming the technology landscape, introducing new large language models (LLMs), development tools and a range of new or enhanced applications. As adoption grows, organizations ...
As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...
If there’s one thing that turns people off from adopting new tech, it’s being forced to look silly and feel uncomfortable for extended lengths of time. It was always the Achilles' heel for 3D in the ...
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