(Bloomberg) -- A secretive American startup has emerged with aspirations to challenge two titans of the semiconductor industry: ASML Holding NV and Taiwan Semiconductor Manufacturing Co. The company, ...

The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

Chip and substrate fabrication might not be the most exciting topic in the world, but when it could lead to significant performance and efficiency improvements, you'd better bet I'm here for it. So, I ...

A San Francisco startup has raised more than $100 million for technology that could upend the global semiconductor industry—if it proves out. Founded by a protégé of investor Peter Thiel, Substrate ...

In a nutshell: TSMC is venturing into uncharted territory with a novel approach to advanced chip packaging. The chipmaker reportedly plans to switch from conventional round wafers to rectangular ...

AP Memory is expanding into AI servers and high-performance computing, with its S-SiCap roadmap delivering concrete progress.

In context: Manufacturers are trying to develop novel chip substrate technologies to save Moore's law and keep crunching the Megahertz rates up. Glass is the most promising material for next-gen ...

South Korean giants Samsung Electronics and SK Group are "speeding up efforts" to secure future dominance in glass substrates, which would be a "game-changer" for the semiconductor and AI industries.

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...

Apple plans to use advanced 3D chip stacking technology in its upcoming MacBook series which is scheduled to be launched in 2025, which is said to be a breakthrough in chip packaging technology. The ...

A new supply-chain report suggests that Apple is seeking to be an early player in what some believe will be the next big thing in chip development: printed circuit boards (PCBs) made from glass ...

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...