A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...
IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...
In 2004, Intel specified a standard integrated Driver-MOSFET (DrMOS) device for use in a typical PC platform. This specification’s goal was to provide features for an integrated device to produce the ...
Radiation-tolerant, high-current-density DC-DC converter modules supply power to the AI1 transponder for innovative computing ...
Point-of-load (PoL) dc/dc converters within intermediate bus power system architectures are pervasive in many applications including 3G and 4G telecom installations, high-performance blade server ...
If you’re an embedded-systems designer looking for compute power, you have a lot of options. I don’t know how many companies make single-board computers, but it is a lot. Maybe 200? And most of those ...
Power modules are high-power switching circuits that convert DC- in AC-currents in electric vehicles, renewable energy, and many more applications. New materials [14] and device technologies [14], ...
Relationship of power density and field strength. Some of the more uncommon power-density apps. RF designers frequently need to know the true power density or field intensity at a particular distance ...
A new generation of 1200 V silicon carbide power modules raises the bar on current density and thermal performance, targeting ...
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