Turn photos into 3D with Meta's SAM 3D, using SAM 2 masks and Gaussian splatting, so you can build assets quickly for ...

The Brokerage’s Land & Ranch Group Will Spearhead the Rollout of the Powerful Platform, Designed to Give All Agents Unmatched ...

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has sh ...

For advanced bonding schemes and panel operations, there is a high cost to discovering an interface issue late in the flow. Reliability improves when materials are specified as a system rather than as ...

Smart glasses are no longer niche gizmos with a fading vanity factor. On the contrary, they now offer a peak into the future ...

MemryX Inc., a company delivering production AI inference acceleration, today announced its strategic roadmap for the MX4.

Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...

D HBM-on-GPU design reaches record compute density for demanding AI workloadsPeak GPU temperatures exceeded 140°C without thermal mitigation strategiesHalving the GPU clock rate reduced temperatures ...

Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of ...

A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring and order-of-magnitude speed gains.