Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
Interesting Engineering on MSN
New ‘necroprinting’ uses mosquito feeding tubes for 3D printing below cell scale
A new manufacturing technique called "3D necroprinting" repurposes mosquito proboscises as biodegradable nozzles for 3D ...
Graphene is often described as a wonder material. It is strong, electrically conductive, thermally efficient, and remarkably ...
Tech Xplore on MSN
Creating realistic 3D scenes from everyday online photos
A new approach is making it easier to visualize lifelike 3D environments from everyday photos already shared online, opening ...
Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
Thermal Modeling in Emerging Heterogeneous 2.5D/3D Systems (EPFL, Universidad Complutense de Madrid)
Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...
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